Onex has been granted a patent for a liquid cooling assembly featuring two heat conducting plates for heat dissipation, a liquid cooling tube for enhanced cooling, and an elastic support that ensures tight attachment to storage modules while allowing for easy separation after use. GlobalData’s report on Onex gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Onex, was a key innovation area identified from patents. Onex's grant share as of July 2024 was 57%. Grant share is based on the ratio of number of grants to total number of patents.
Liquid cooling assembly for efficient heat dissipation
The granted patent US12058839B2 outlines a liquid cooling assembly designed to enhance heat dissipation for storage modules. The assembly consists of two heat conducting plates that are attached to the storage modules, a liquid cooling tube positioned at the end of the plates for effective cooling, and an elastic support mechanism. This elastic support, described as a U-shaped stopper, is strategically placed between the heat conducting plates to apply pressure during the attachment process, ensuring a tight fit against the storage modules. This design facilitates both efficient heat transfer and ease of separation of the storage modules from the heat conducting plates once the elastic support is removed.
Additionally, the patent details various configurations and components of the liquid cooling assembly. It specifies that the elastic support can also be an elastic reed, and the liquid cooling tube may be connected to the heat conducting plates via a flexible connector, which can be an elastic metal sheet or a soft metal strap. The assembly can be configured with either a single liquid cooling tube connecting both heat conducting plates or individual tubes for each plate. Furthermore, each heat conducting plate is designed with a layer and a gasket, which may consist of multiple sub-gaskets tailored to match the dimensions of the storage modules. The patent also describes a broader liquid cooling apparatus that incorporates multiple slots for storage modules, with the cooling assembly positioned between adjacent slots to optimize thermal management.
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